- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 3/10 - Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
Patent holdings for IPC class H05K 3/10
Total number of patents in this class: 2118
10-year publication summary
275
|
226
|
219
|
165
|
169
|
160
|
143
|
103
|
146
|
35
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
FUJIFILM Corporation | 27102 |
50 |
Ibiden Co., Ltd. | 1724 |
47 |
Fuji Corporation | 2924 |
47 |
LG Innotek Co., Ltd. | 6758 |
39 |
Intel Corporation | 45621 |
33 |
Unimicron Technology Corp. | 449 |
29 |
LG Chem, Ltd. | 17205 |
28 |
Avary Holding (Shenzhen) Co., Limited. | 275 |
27 |
Apple Inc. | 50209 |
25 |
Shinko Electric Industries Co., Ltd. | 1186 |
25 |
Samsung Electro-mechanics Co., Ltd. | 4798 |
24 |
Nitto Denko Corporation | 7879 |
24 |
International Business Machines Corporation | 60644 |
22 |
at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 427 |
22 |
Sumitomo Electric Industries, Ltd. | 14131 |
20 |
Eastman Kodak Company | 3444 |
19 |
HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. | 124 |
18 |
AmaTech Group Limited | 68 |
18 |
3m Innovative Properties Company | 18406 |
17 |
Murata Manufacturing Co., Ltd. | 22355 |
17 |
Other owners | 1567 |